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Resources
Design and DFM
2025-Stress-related Local Layout Effects in FinFET Technology and Device Design Sensitivity
SPIE 2009 – Simplify to Survive, prescriptive layouts ensure profitable scaling to 32nm and beyond
SPIE 2009 – OPC Simplification and Mask Cost Reduction Using Regular Design Fabrics
ISSM 2006 – Method for fast and accurate calibration of litho simulator for hot spot analysis
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