PDF Solutions Users Conference Resources
The 2024 PDF Solutions China Users Conference took place on March 15, 2024, in Shanghai, China. Below are some of the presentations delivered during this one-day event.
The 2023 PDF Solutions Users Conference took place on October 24th and 25th 2023 in Santa Clara, CA. PDF Solutions Executives and Technical Leaders delivered a series of keynote presentations on the following topics:
- The evolution of the Semiconductor Industry and PDF Solutions strategy.
- PDF Solutions for various market segments: Fabs, IDMs, Fabless, Equipment providers, Automotive industry, etc.
- PDF Solutions platform architecture.
- PDF Solutions unique approach to AI for the Semiconductor Industry.
- Solution Innovation in Test, Process Control, AI/ML, etc.
- PDF Solutions approach for the development of semiconductor manufacturing analytical skills across the industry.
Links to the videos and presentation materials are provided below.
PDF Solutions Executive Presentations
Customer and Partner Presentations
Brad Clay, GlobalFoundries, “GlobalFoundries Business & Digital Transformation”
Sanjay Natarajan, Intel, “Moore’s Law in Action: Accelerating Semiconductor Process Technology”
Mike O’Sullivan, ADI, “Deploying an Analytics platform to drive digital transformation in the Semiconductor Space.”
Ken MacWilliams, Multibeam, “Enabling Innovators to Fast-Track Next-Gen IC Designs to Production”
Keith Schaub, Advantest, “Innovate with AI at the Edge”
Smitha Mathews, ADI, “The Journey to Scale Exensio: Lessons Along the Way”
Helen Yu, Renesas, “Improved Yield, Test and Quality”
Eli Roth, Teradyne, “Teradyne and PDF Solutions Collaborate on the Next Evolution in Real-Time Analytics”
Tami Shlasky Nachalon, proteanTecs, “Big Data & Deep Data – a Winning Synergy”
Jayant D’Souza, Siemens, “Improve Yield by Addressing Layout Pattern Systematic Defects”
Gautham Unni, AWS, “Semiconductor Innovation Enabled by AWS”
Tim Wagner and Dave Huntley, Vendia & PDF Solutions, “Powering Semiconductor Industry Solutions via Blockchain”